The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2006
Filed:
Sep. 30, 2004
Joze E. Antol, Hamburg, PA (US);
Philip William Seitzer, Bethlehem, PA (US);
Daniel Patrick Chesire, Winter Garden, FL (US);
Rafe Carl Mengel, Hamburg, PA (US);
Vance Dolvan Archer, Asbury Park, NJ (US);
Thomas B. Gans, Doylestown, PA (US);
Taeho Kook, Orlando, FL (US);
Sailesh M. Merchant, Macungie, PA (US);
Joze E. Antol, Hamburg, PA (US);
Philip William Seitzer, Bethlehem, PA (US);
Daniel Patrick Chesire, Winter Garden, FL (US);
Rafe Carl Mengel, Hamburg, PA (US);
Vance Dolvan Archer, Asbury Park, NJ (US);
Thomas B. Gans, Doylestown, PA (US);
Taeho Kook, Orlando, FL (US);
Sailesh M. Merchant, Macungie, PA (US);
Agere Systems, Inc., Allentown, PA (US);
Abstract
Disclosed herein are novel support structures for pad reinforcement in conjunction with new bond pad designs for semiconductor devices. The new bond pad designs avoid the problems associated with probe testing by providing a probe region that is separate from a wire bond region. Separating the probe regionfrom the wire bond regionand forming the bond padover active circuitry has several advantages. By separating the probe regionfrom the wire bond region, the wire bond regionis not damaged by probe testing, allowing for more reliable wire bonds. Also, forming the bond padover active circuitry, including metal interconnect layers, allows the integrated circuit to be smaller.