Philip H Allen

Title: Innovations by Philip H Allen in Microelectronics Manufacturing

Introduction

Philip H Allen is an accomplished inventor based in Rolla, MO (US). He has made significant contributions to the field of microelectronics manufacturing, particularly through his innovative patents. With a total of 2 patents, Allen has developed methods and devices that enhance the efficiency and effectiveness of substrate coating processes.

Latest Patents

Allen's latest patents focus on a device for coating the outer edge of a substrate during microelectronics manufacturing. These patents introduce new baffles and methods designed to improve the coating process. The baffles feature a body with an edge wall that directs the flow of a composition against the edge of a substrate, such as a silicon wafer. The design includes a vertical surface, a curved sidewall, and a lip, with a preferred annular shape made from a synthetic resinous composition. Notably, these baffles are not made of metal. The inventive methods involve positioning the baffle adjacent to the substrate during a spin coating process, ensuring that the edge wall effectively covers the edges and a portion of the back side of the substrate.

Career Highlights

Philip H Allen is currently associated with Brewer Science, Inc., where he continues to innovate in the field of microelectronics. His work has been instrumental in advancing the technology used in substrate coating, which is critical for the production of high-quality microelectronic devices.

Collaborations

Throughout his career, Allen has collaborated with notable colleagues, including Gary J Brand and Ramachandran K Trichur. These collaborations have contributed to the development of his innovative patents and have fostered a productive research environment.

Conclusion

Philip H Allen's contributions to microelectronics manufacturing through his patents demonstrate his commitment to innovation and excellence in the field. His work continues to influence the industry, paving the way for advancements in substrate coating technologies.