New York, NY, United States of America

Philip B Pinches

This inventor holds 1 USPTO granted patent. Top assignee: Upa Technology, Inc.. Active years: 1984.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Philip B Pinches. Retrieved from https://idiyas.com/inventor/philip-b-pinches

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 1984

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1 patent (USPTO):Explore Patents

Title: The Innovations of Philip B. Pinches

Introduction

Philip B. Pinches is an accomplished inventor based in New York, NY. He is known for his significant contributions to the field of measuring instruments, particularly in the area of beta ray measurement technology. With one patent to his name, Pinches has made a notable impact in his industry.

Latest Patents

His most recent patent is titled "Workpiece positioning system for beta ray measuring instruments." This innovative system includes a beta backscatter type of measuring instrument that features a workpiece positioning system. This system allows for precise prepositioning of the workpiece surface to be subjected to radiation, which is essential for moving the radiation source into operative proximity.

Career Highlights

Philip B. Pinches is currently employed at UPA Technology, Inc., where he continues to develop and refine his inventions. His work has been instrumental in advancing the capabilities of measuring instruments used in various applications.

Collaborations

Throughout his career, Pinches has collaborated with notable individuals in his field, including his coworker Sidney Lieber. Their combined expertise has contributed to the success of their projects and innovations.

Conclusion

Philip B. Pinches exemplifies the spirit of innovation in the field of measuring instruments. His work continues to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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