Philip A Panackal

Title: Innovations by Philip A Panackal

Introduction

Philip A Panackal is an accomplished inventor based in Odenton, MD (US). He has made significant contributions to the field of electronic assemblies through his innovative patent. His work focuses on enhancing the efficiency and performance of thermal interface materials, which are crucial for the proper operation of electronic devices.

Latest Patents

Philip A Panackal holds a patent for a thermal interface material designed for electronic assemblies. This invention addresses the need for effective heat transfer between surface mount components and printed wiring boards, as well as between printed wiring boards and metal heat sinks. The patented material is a fully-cured, flexible, filled elastomer that is coated on both sides with a partially cured, filled adhesive. This unique approach allows for good adhesion, excellent heat transfer, and compliance to accommodate mismatched coefficients of thermal expansion. The material can be produced using a low-cost tape casting process, making it both efficient and practical for use in various applications.

Career Highlights

Philip A Panackal is currently employed at Northrop Grumman Systems Corporation, where he continues to innovate and contribute to advancements in technology. His expertise in thermal interface materials has positioned him as a valuable asset within the company.

Collaborations

Throughout his career, Philip has collaborated with notable colleagues, including Paul P Frank and Kenneth C Radford. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Philip A Panackal's contributions to the field of electronic assemblies through his innovative patent demonstrate his commitment to advancing technology. His work not only enhances the performance of electronic devices but also showcases the importance of effective thermal management in modern engineering.