The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Apr. 05, 2006
Paul P. Frank, Woodstock, MD (US);
Kenneth C. Radford, Gambrills, MD (US);
Karl F. Schoch, Jr., Catonsville, MD (US);
Eileen M. Wojtal, Columbia, MD (US);
Philip A. Panackal, Odenton, MD (US);
Paul P. Frank, Woodstock, MD (US);
Kenneth C. Radford, Gambrills, MD (US);
Karl F. Schoch, Jr., Catonsville, MD (US);
Eileen M. Wojtal, Columbia, MD (US);
Philip A. Panackal, Odenton, MD (US);
Northrop Grumman Corporation, Baltimore, MD (US);
Abstract
Thermal interface materials are essential for proper operation of electronic assemblies. They are used between surface mount components and printed wiring boards and between printed wiring boards and metal heat sinks. Their function is to bond the components together and allow good heat transfer between the parts being bonded. The approach disclosed in this invention is a fully-cured, flexible, filled elastomer that is coated on both sides with a partially cured, filled adhesive, which can be conveniently made by a low cost tape casting process. This unique approach offers a combination of good adhesion to both bonding surfaces, good heat transfer, compliance to accommodate mismatched coefficient of thermal expansion, rework capability, control of flow of the adhesive during cure, and easy handling of uncured material.