Paul P Frank

Title: Innovations of Paul P. Frank in Thermal Interface Materials

Introduction

Paul P. Frank, an inventor based in Woodstock, MD, has made significant contributions to the field of electronic assemblies through his innovative work on thermal interface materials. His unique approach to bonding components has enhanced the functionality and efficiency of electronic devices.

Latest Patents

Paul P. Frank holds a notable patent for a thermal interface material specifically designed for electronic assemblies. This invention addresses the crucial role that thermal interface materials play in ensuring proper operation by facilitating effective heat transfer between surface mount components, printed wiring boards, and metal heat sinks. The invention is characterized by a fully-cured, flexible, filled elastomer that is coated on both sides with a partially cured, filled adhesive. This design is not only economical due to the low-cost tape casting process but also provides excellent adhesion, compliance for differing thermal expansion, and manageable handling of the uncured material.

Career Highlights

Paul P. Frank is currently employed at Northrop Grumman Systems Corporation, where he leverages his expertise to further advancements in technology and engineering. His work directly impacts the performance of electronic products, contributing to the overall reliability and efficiency of modern electronics.

Collaborations

Throughout his career, Paul has collaborated with fellow innovators, including Kenneth C. Radford and Karl F. Schoch, Jr. These partnerships have played a significant role in the development and refinement of technologies that support the electronic industry.

Conclusion

Paul P. Frank's innovation in thermal interface materials exemplifies the critical role of inventors in advancing technology. His patent not only reflects his ingenuity but also addresses a pressing need in the electronics sector, showcasing the importance of proper heat management in electronic assemblies.