This inventor holds 1 USPTO granted patent. Top assignee: Motorola Corporation. Active years: 2001.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2001
Title: Peter Zhihua Yuan and Semiconductor Package Underfilling
Introduction
Peter Zhihua Yuan is an inventor associated with Singapore. His patent work concerns a method and machine for underfilling an assembly to form a semiconductor package.
Latest Patents
The provided information lists 1 patent for Yuan: “Method and Machine for Underfilling an Assembly to Form a Semiconductor Package.” The invention describes conveying an assembly on tracks through preheating, dispensing, and postheating zones. The assembly includes a flexible tape substrate and an inverted semiconductor die. In the dispensing zone, underfill material is applied to the heated substrate so it can flow into the gap between the substrate and die. Postheating supports continued flow of the material into that gap.
Career Highlights
Yuan is associated with Motorola Corporation. His listed patent focuses on a continuous process for applying underfill material during semiconductor package assembly.
Collaborations
The provided information names James Boon Hua How and Han Yang Chua as Yuan’s coworkers. Their names are associated with his professional context, though specific collaborative roles are not provided.
Conclusion
Peter Zhihua Yuan’s listed invention addresses semiconductor packaging through a machine-based process designed to promote consistent underfill flow beneath an inverted die.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile