The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2001
Filed:
Jan. 19, 2000
James Boon Hua How, Singapore, SG;
Han Yang Chua, Singapore, SG;
Peter Zhihua Yuan, Singapore, SG;
Nee Seng Ling, Singapore, SG;
Motorola, Inc., Schaumburg, IL (US);
Abstract
A method and machine (,) for underfilling an assembly (,) to form semiconductor package is disclosed. The machine (,) has conveying tracks (,) for continuously conveying the assembly (,) past zones. The assembly (,) has a flexible tape substrate (,) with a mounted inverted semiconductor die (,). The machine includes a preheating zone (,), a dispensing zone (,) for dispensing an underfill material onto the substrate (,) whilst heating the assembly (,) to allow the underfill to flow into a gap between the substrate (,) and semiconductor die (,). The machine (,) also has a postheating zone (,) for postheating the assembly (,) after dispensing to provide for a continuous flow of the underfill into the gap.