Peter Walters

Title: Innovations of Peter Walters in Electronic Packaging

Introduction

Peter Walters is an accomplished inventor based in Santa Rosa, CA (US). He has made significant contributions to the field of electronic packaging, particularly with his innovative designs that enhance the performance and manufacturability of electronic components. His work is characterized by a focus on efficiency and cost-effectiveness.

Latest Patents

Peter Walters holds a patent for a "Lead-frame based vertical interconnect package." This invention presents a vertical interconnect package (VIP) for electronic components, along with a method for its manufacture. The VIP features a tripartite lead frame that integrates feedthrough and shielding within a non-ceramic package. One frame serves as the substrate for coupling the integrated circuit (IC) device, while the second and third lead frames provide shielding and feedthroughs, with the third also functioning as a lid to create an airtight chamber around the IC. The design includes a ground button divided into sections for improved RF and ground paths, utilizing lead frame connections for direct current (DC). The assembly method involves batch lead frame assembly and testing prior to singulation. This innovation offers enhanced performance at a lower manufacturing cost and facilitates easy interfaces with printed circuit boards in surface mount technology manufacturing, while also being compatible with die mount technologies such as flip-chip.

Career Highlights

Peter Walters is currently employed at Hewlett-Packard Company, where he continues to develop innovative solutions in electronic packaging. His work has been instrumental in advancing the capabilities of electronic components, making them more efficient and reliable.

Collaborations

Peter has collaborated with Brian R Hutchison, a fellow innovator, to further enhance the development of electronic packaging technologies.

Conclusion

Peter Walters is a notable inventor whose contributions to electronic packaging have significantly impacted the industry. His innovative designs and methods continue to pave the way for advancements in electronic component manufacturing.