The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2000
Filed:
Sep. 08, 1997
Brian R Hutchison, Windsor, CA (US);
Peter Walters, Santa Rosa, CA (US);
Hewlett-Packard Company, Palo Alto, CA (US);
Abstract
A vertical interconnect package for electronic components and a method to manufacture same. The invention provides a tripartite lead frame-based Vertical Interconnect Package (VIP) which provides integrated feedthrough and integrated shielding in a non-ceramic package. One frame functions as the substrate for coupling the IC device, the second lead frame and third lead frames form shielding and feedthroughs, with the third also providing a lid whereby an airtight chamber around the IC is formed. The invention provides a ground button (the shortest path to the die) divided into n sections providing additional RF and separate ground paths; lead frame connections are used for DC. A method for assembling includes batch lead frame assembly and test prior to singulation. The VIP provides improved performance at lower manufacturing cost and provides easy interfaces to the printed circuit board in surface mount technology manufacturing and is compatible with die mount technologies such as flip-chip.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile