Wappingers Falls, NY, United States of America

Peter Schulz

This inventor holds 1 USPTO granted patent. Top assignee: Siemens Components, Inc.. Active years: 1997.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Peter Schulz. Retrieved from https://idiyas.com/inventor/peter-schulz-ggs5dmwx

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 34(Granted Patents)


Company Filing History:


Years Active: 1997

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1 patent (USPTO):Explore Patents

Title: The Innovations of Peter Schulz

Introduction

Peter Schulz is an accomplished inventor based in Wappingers Falls, NY (US). He has made significant contributions to the field of semiconductor technology. His work primarily focuses on improving the quality of silicon wafers, which are essential components in the electronics industry.

Latest Patents

Peter Schulz holds a patent for a method aimed at reducing metal contamination of silicon wafers during the cleaning process. The patent describes a complex building agent, such as EDTA, which is added in a predetermined concentration to the 'SC 1' step of a 'PIRANHA-RCA' cleaning sequence. This innovative approach effectively reduces the metal contamination left on the surface of a silicon wafer after the completion of this cleaning step. He has 1 patent to his name.

Career Highlights

Peter Schulz is currently employed at Siemens Components, Inc., where he continues to develop and refine technologies that enhance semiconductor manufacturing processes. His expertise in this area has made him a valuable asset to the company.

Conclusion

Peter Schulz's contributions to the field of semiconductor technology demonstrate his commitment to innovation and excellence. His patented method for reducing metal contamination in silicon wafers is a testament to his ingenuity and dedication to improving manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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