Peter S Wang

Title: Innovations of Peter S. Wang

Introduction

Peter S. Wang is a notable inventor based in Basking Ridge, NJ (US). He has made significant contributions to the field of integrated circuit technology, holding a total of four patents. His work focuses on enhancing the efficiency and functionality of electronic components.

Latest Patents

One of his latest patents is for an integrated circuit chip package with test points. This innovative flip-chip IC package is designed for ease of testing and comprises a substrate along with a plurality of stiffener walls, each carrying an IC. The design ensures electrical continuity between the substrate and the ICs through conductive bumps. The inclusion of test points on the surfaces of the substrate and stiffener walls facilitates effective testing of conductivity and functionality of the ICs.

Another significant patent by Wang is for a very thin multi-chip package and the method of mass-producing it. This invention features a substrate assembly that boasts a very thin form factor and offers substantial manufacturing flexibility. The flexible tape assembly, which includes device blocks, is electrically tested before being joined to the substrate, allowing for a compact and efficient design.

Career Highlights

Peter S. Wang has worked with several prominent organizations throughout his career. Notably, he has been associated with Ang Technologies Inc. and the Institute of Microelectronics. His experience in these companies has contributed to his expertise in the field of microelectronics and integrated circuit design.

Collaborations

Wang has collaborated with various professionals in his field, including Yu-Wen Huang, enhancing the scope and impact of his innovations.

Conclusion

Peter S. Wang's contributions to integrated circuit technology through his patents reflect his innovative spirit and dedication to advancing electronic components. His work continues to influence the industry and pave the way for future developments.