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For the Inventor, By the Inventor

Basking Ridge, NJ, United States of America

Ang Technologies Inc.


USPTO Granted Patents = 2

% Expired Patents = 50.0

Forward Citations = 30

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2 inventors (with patents filed for the assignee):

goldMedal Yu-Wen Huang (2 out of 252 patents)

silverMedal Peter Shaomin Wang (2 out of 167 patents)


2 patents:

1. 6437436 - Integrated circuit chip package with test points (2002-08-20),
2. 6026564 - Method of making a high density multilayer wiring board (2000-02-22),
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USPTO Data Jan 1 1976 - Sep 15 2026

2 Patents

#33 in Basking Ridge, NJ

#3,400 in New Jersey

#94,722 in US

Basking Ridge, NJ (US)
Basking Ridge, NJ, United States of America

Ang Technologies Inc.

Forward Citations = 30

2 inventors:

goldMedal Yu-Wen Huang (2 out of 252 patents)

silverMedal Peter Shaomin Wang (2 out of 167 patents)

Please report any incorrect information to [email protected]
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