Company Filing History:
Years Active: 2014-2016
Title: The Innovations of Penglin Mei
Introduction
Penglin Mei is a notable inventor based in Tianjin, China. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on enhancing the efficiency and reliability of semiconductor devices.
Latest Patents
Among his latest patents is a semiconductor device with a heat spreader. This innovative device includes a package body, a semiconductor die embedded within it, and a heat spreader attached to the top surface of the package body, which is spaced from the semiconductor die. The heat spreader is formed of solder that is melted within a recess in the top surface of the package body. Another notable patent is for a semiconductor package with stress relief and a heat spreader. This device features a die mounted on a die paddle that is elevated above and thermally connected via tie bars to a heat sink structure. Heat generated by the die flows from the die to the die paddle, then to the tie bars, and finally to the heat sink structure, allowing for efficient heat dissipation.
Career Highlights
Penglin Mei is currently employed at Freescale Semiconductor, Inc., where he continues to innovate in the semiconductor field. His work has been instrumental in developing advanced semiconductor solutions that address common challenges in the industry.
Collaborations
He has collaborated with several talented individuals, including You Ge and Meng Kong Lye, who have contributed to his projects and innovations.
Conclusion
Penglin Mei's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence the development of efficient and reliable semiconductor devices.