The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2015

Filed:

Aug. 19, 2014
Applicants:

Penglin Mei, Tianjin, CN;

You GE, Tianjin, CN;

Meng Kong Lye, Shah Alam, MY;

Inventors:

Penglin Mei, Tianjin, CN;

You Ge, Tianjin, CN;

Meng Kong Lye, Shah Alam, MY;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01);
Abstract

A semiconductor device including a lead frame, a routing substrate disposed within the lead frame, and an active component mounted on the routing substrate. The active component has a plurality of die pads. The routing substrate includes a set of first bond pads, a set of second bond pads, and interconnections, where each interconnection provides an electrical connection between a first bond pad and a corresponding second bond pad. The semiconductor device further includes electrical couplings between one or more of die pads of the active component and corresponding first bond pads of the routing substrate, as well as electrical couplings between leads of the lead frame and respective second bond pads of the routing substrate.


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