The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2015
Filed:
May. 15, 2014
Kai Yun Yow, Petaling Jaya, MY;
Poh Leng Eu, Petaling Jaya, MY;
Meng Kong Lye, Shah Alam, MY;
You GE, Tianjin, CN;
Penglin Mei, Tianjin, CN;
Kai Yun Yow, Petaling Jaya, MY;
Poh Leng Eu, Petaling Jaya, MY;
Meng Kong Lye, Shah Alam, MY;
You Ge, Tianjin, CN;
Penglin Mei, Tianjin, CN;
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Abstract
A semiconductor device has a die mounted on a die paddle that is elevated above and thermally connected via tie bars to a heat sink structure. Heat generated by the die flows from the die to the die paddle to the tie bars to the heat sink structure and then to either the external environment or to an external heat sink. By elevating the die/paddle sub-assembly above the heat sink structure, the packaged device is less susceptible to delamination between the die and die attach adhesive and/or the die attach adhesive and the die paddle. An optional heat sink ring can surround the die paddle.