Peng Sun

Title: Innovations of Inventor Peng Sun

Introduction

Peng Sun is a notable inventor based in Hong Kong, China. He has made significant contributions to the field of electronic packaging, holding 2 patents that showcase his innovative approach to technology.

Latest Patents

One of his latest patents is titled "Electronic package with stacked modules with channels passing through metal layers of the modules." This invention provides an electronic package comprising at least a first and a second module arranged in a stack. The modules are adhesively connected, each featuring a substrate layer with metal layers, dice, and a plastic package molding compound layer. The design includes a plurality of channels that act as vias for electrical connection, enhancing the connectivity between the dice.

Another significant patent is the "Bonding method for through-silicon-via based 3D wafer stacking." This method describes a process for bonding a wafer stack with through-silicon-vias and lateral microchannels filled with solder. The wafers are placed in a soldering chamber where molten solder is drawn through the vias and channels by vacuum. This innovative approach allows for effective assembly and bonding of the wafer stack.

Career Highlights

Peng Sun is associated with the Hong Kong Applied Science and Technology Research Institute Company, Limited. His work at this institution has allowed him to focus on cutting-edge research and development in electronic packaging technologies.

Collaborations

He has collaborated with notable coworkers such as Chi Kuen Vincent Leung and Xunqing Shi, contributing to advancements in their respective fields.

Conclusion

Peng Sun's innovative patents and contributions to electronic packaging demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and inspire future innovations.