The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2011
Filed:
Jun. 02, 2008
Chi Kuen Vincent Leung, Tin Shui Wai, HK;
Peng Sun, Fanling, HK;
Xunqing Shi, Fanling, HK;
Chang Hwa Chung, Shatin, HK;
Chi Kuen Vincent Leung, Tin Shui Wai, HK;
Peng Sun, Fanling, HK;
Xunqing Shi, Fanling, HK;
Chang Hwa Chung, Shatin, HK;
Hong Kong Applied Science and Technology Research Institute Company Limited, Shatin, New Territories, HK;
Abstract
There is described a bonding method for through-silicon-via bonding of a wafer stack in which the wafers are formed with through-silicon-vias and lateral microchannels that are filled with solder. To fill the vias and channels the wafer stack is placed in a soldering chamber and molten solder is drawn through the vias and channels by vacuum. The wafers are held together by layers of adhesive during the assembly of the wafer stack. Means are provided for local reheating of the solder after it has cooled to soften the solder to enable it to be removed from the soldering chamber.