Hong Kong, China

Chi Kuen Vincent Leung

This inventor holds 4 USPTO granted patents. Top assignee: Hong Kong Applied Science and Technology Research Institute. Active years: 2010-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chi Kuen Vincent Leung. Retrieved from https://idiyas.com/inventor/chi-kuen-vincent-leung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 50.0

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 55(Granted Patents)


Company Filing History:


Years Active: 2010-2013

Loading Chart...
4 patents (USPTO):Explore Patents

Title: Innovations by Chi Kuen Vincent Leung

Introduction

Chi Kuen Vincent Leung is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of electronic component alignment and packaging. With a total of 4 patents to his name, Leung continues to push the boundaries of technology through his innovative designs.

Latest Patents

Leung's latest patents include an "Apparatus for aligning electronic components." This invention describes a method of aligning electronic components by providing a positioning member with formations for receiving the components. The design includes lateral boundaries that constrain the movement of the components, ensuring precise alignment. The alignment can be achieved through various means, such as tilting the positioning member or using suction.

Another significant patent is for an "Electronic package with stacked modules with channels passing through metal layers of the modules." This invention outlines a modular electronic package where multiple modules are adhesively connected. Each module contains a substrate layer with metal layers and channels that facilitate electrical connections between the dice. This innovative design enhances electrical, mechanical, and thermal connectivity within the electronic package.

Career Highlights

Chi Kuen Vincent Leung is affiliated with the Hong Kong Applied Science and Technology Research Institute. His work at this esteemed institution has allowed him to focus on advancing technology in electronic components and packaging.

Collaborations

Leung has collaborated with notable colleagues, including Xunqing Shi and Peng Sun. Their combined expertise has contributed to the successful development of innovative technologies in their field.

Conclusion

Chi Kuen Vincent Leung is a prominent inventor whose work in electronic component alignment and packaging has led to several patents. His contributions continue to influence the technology landscape, showcasing the importance of innovation in advancing electronic systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…