Location History:
- Santa Clara, CA (US) (2019 - 2020)
- Sunnyvale, CA (US) (2021 - 2022)
Company Filing History:
Years Active: 2019-2022
Title: The Innovations of Peng Su
Introduction
Peng Su is a notable inventor based in Sunnyvale, CA (US). He has made significant contributions to the field of integrated circuits and electronic packaging. With a total of 6 patents to his name, his work has had a considerable impact on technology.
Latest Patents
Among his latest patents is an innovative apparatus, system, and method for utilizing package stiffeners to attach cable assemblies to integrated circuits. This disclosed apparatus includes an integrated circuit electrically coupled to a substrate, a plurality of electrical contacts disposed on the substrate, and at least one cable assembly electrically coupled to these contacts. The package stiffener is physically coupled to the substrate around the integrated circuit, ensuring accessibility for the cable assembly.
Another significant patent involves a system and method for attaching an integrated circuit package to a printed circuit board using solder balls with a coined surface profile. This method includes positioning an integrated circuit package in a coining apparatus, where the integrated circuit device is supported while the solder balls are pressed to achieve a desired surface profile.
Career Highlights
Peng Su is currently employed at Juniper Networks, Inc., where he continues to innovate and develop new technologies. His work at Juniper Networks has allowed him to collaborate with other talented professionals in the field.
Collaborations
Some of his notable coworkers include Gautam Ganguly and Marc D Hartranft. Their combined expertise contributes to the advancement of technology within their organization.
Conclusion
Peng Su's contributions to the field of integrated circuits and electronic packaging are noteworthy. His innovative patents and collaborations reflect his commitment to advancing technology. His work continues to influence the industry and inspire future innovations.