Peng-Hisn Lee

Title: Innovations of Peng-Hisn Lee

Introduction

Peng-Hisn Lee is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of electronics, particularly in interconnection structures. His work is characterized by innovative designs that enhance the functionality and efficiency of electronic devices.

Latest Patents

Peng-Hisn Lee holds a patent for an "Interconnection structure having a via structure." This invention features a substrate with at least one electric device formed adjacent to a first side of the substrate. A via hole is formed through the substrate, with a first opening adjacent to the first side. The via structure is disposed in the via hole without exceeding the first opening. A first pad is placed on the first side of the substrate, covering the via hole, while a second pad is located on the opposite side. The via structure extends into the second pad, allowing for electrical connection with the electric device. The first pad includes a protrusion portion that extends into the via hole, enhancing connectivity.

Career Highlights

Peng-Hisn Lee is currently employed at Delta Electronics, Inc., where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of electronic components and systems.

Collaborations

He has collaborated with notable coworkers, including Chia-Yen Lee and Hsin-Chang Tsai, contributing to various projects that push the boundaries of electronic design.

Conclusion

Peng-Hisn Lee's contributions to the field of electronics through his innovative patent and collaborative efforts highlight his importance as an inventor. His work continues to influence the development of advanced electronic technologies.