The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2015

Filed:

Nov. 13, 2012
Applicant:

Delta Electronics, Inc., Taoyuan Hsien, TW;

Inventors:

Hsin-Chang Tsai, Taoyuan Hsien, TW;

Chia-Yen Lee, Taoyuan Hsien, TW;

Peng-Hisn Lee, Taoyuan Hsien, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 24/91 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 25/074 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/0332 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05009 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/13064 (2013.01);
Abstract

An interconnection structure is provided having a substrate with at least one electric device formed adjacent to a first side of the substrate and a via hole formed therethrough. The via hole has a first opening adjacent to the first side of the substrate. A via structure is disposed in the via hole without exceeding the first opening. A first pad is disposed on the first side of the substrate and covers the via hole. A second pad is disposed on a second side of the substrate opposite to the first side, wherein the via structure extends into the second pad. The first pad is adjoined to the via structure and electrically connects with the at least one electric device, and the first pad has a protrusion portion extending into the via hole.


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