This inventor holds 1 USPTO granted patent. Top assignee: Chipbond Technology Corporation. Active years: 2022.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022
Title: Pei-Ying Lee and Flexible Circuit Board Heat Management.
Introduction
Pei-Ying Lee is an inventor associated with Kaohsiung, Taiwan, and Chipbond Technology Corporation. Her work includes a patent for a flexible circuit board and its heat spreader.
Latest Patents
Lee’s listed patent, “Flexible Circuit Board and Heat Spreader Thereof,” describes a flexible substrate with an electronic component on its top surface and a heat spreader on its bottom surface. The heat spreader includes a copper layer in which at least 50% of the copper grains by volume have a (1,0,0) crystallographic orientation. This design addresses heat spreading in a flexible circuit board. Lee is listed as having 1 patent.
Career Highlights
Lee is associated with Chipbond Technology Corporation, a company involved in semiconductor packaging and related technologies. Her patent reflects work on thermal management for flexible electronic assemblies.
Collaborations
Lee’s listed coworkers include Dong-Sheng Li and Yi-Ling Hsieh. The available information identifies them as colleagues but does not specify their roles in the patent.
Conclusion
Pei-Ying Lee’s patent focuses on combining a flexible circuit board with a copper-based heat spreader to manage heat in electronic assemblies.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile