Pei-Wen Wu

Title: Pei-Wen Wu: Innovator in Metal Adhesion Technology

Introduction

Pei-Wen Wu is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in enhancing metal adhesion processes. His innovative work has led to the development of a patent that addresses critical challenges in metal plug adhesion.

Latest Patents

Pei-Wen Wu holds a patent for a "Metal adhesion layer to promote metal plug adhesion." This invention involves forming a metal adhesion layer on the bottom and sidewalls of a trench before the formation of a metal plug. The use of plasma to modify the phase composition of the metal adhesion layer is a key aspect of this patent. This modification increases the adhesion between the metal adhesion layer and the metal plug by transforming the phase composition to a (111) dominant phase, which significantly enhances the adhesion properties.

Career Highlights

Pei-Wen Wu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this prestigious company has allowed him to focus on innovative solutions that improve manufacturing processes and product reliability.

Collaborations

Pei-Wen Wu collaborates with talented colleagues, including Chun-I Tsai and Chi-Cheng Hung. These partnerships foster a creative environment that encourages the development of groundbreaking technologies in the semiconductor field.

Conclusion

Pei-Wen Wu's contributions to metal adhesion technology exemplify the importance of innovation in the semiconductor industry. His patent and collaborative efforts continue to influence advancements in manufacturing processes.