This inventor holds 1 USPTO granted patent. Top assignee: Industrial Technology Research Institute. Active years: 2000.
Company Filing History:
Years Active: 2000
Title: Pei-Wen Ding: Innovator in High-Density Multilayer Printed Circuit Boards
Introduction
Pei-Wen Ding is a notable inventor based in Chiayi, Taiwan. She has made significant contributions to the field of printed circuit board technology. Her innovative methods have paved the way for advancements in high-density multilayer printed circuit boards.
Latest Patents
Pei-Wen Ding holds a patent for a "Method for manufacturing high-density multilayer printed circuit boards." This patent outlines a comprehensive process that includes several steps, such as forming conductive layers, creating via holes, and utilizing laser drilling techniques. The method enhances the efficiency and effectiveness of manufacturing multilayer printed circuit boards.
Career Highlights
Pei-Wen Ding is associated with the Industrial Technology Research Institute, where she has been instrumental in developing cutting-edge technologies. Her work has not only contributed to her organization but has also had a broader impact on the electronics industry.
Collaborations
Pei-Wen Ding has collaborated with esteemed colleagues, including Man-Lin Chen and Ming-Shun Chan. These partnerships have fostered innovation and have led to the successful development of advanced technologies in their field.
Conclusion
Pei-Wen Ding's contributions to the field of printed circuit boards exemplify her dedication to innovation and technology. Her patent and collaborative efforts highlight her role as a key figure in advancing electronic manufacturing processes.