Hsinchu, Taiwan

Pei-Liang Chiu

USPTO Granted Patents = 10 

 

Average Co-Inventor Count = 1.1

ph-index = 1

Forward Citations = 8(Granted Patents)


Location History:

  • Hsinchu Science Park, TW (2008)
  • Hsinchu, TW (2011 - 2021)

Company Filing History:


Years Active: 2008-2025

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10 patents (USPTO):Explore Patents

Title: Pei-Liang Chiu: Innovator in Package Substrate Technology

Introduction

Pei-Liang Chiu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electronics, particularly in the development of advanced package substrate technologies. With a total of nine patents to his name, Chiu has established himself as a key figure in innovation.

Latest Patents

Chiu's latest patents include a novel structure of a package substrate. This innovative design features a first multi-layer substrate that consists of multiple dielectric layers and metal wiring layers. The structure includes a supporting substrate that is electrically connected to the multi-layer substrate without any gaps. Additionally, he has developed a probe card device that incorporates a thin film substrate, a circuit board, and a series of non-deformable probes, enhancing the efficiency of electronic testing.

Career Highlights

Throughout his career, Pei-Liang Chiu has worked with notable companies such as Princo Corporation and Princo America Corporation. His work in these organizations has allowed him to refine his skills and contribute to cutting-edge technologies in the electronics sector.

Collaborations

Chiu has collaborated with talented individuals in his field, including Phou-shen Ou and Ting-Wei Yang. These partnerships have fostered innovation and have led to the successful development of various technologies.

Conclusion

Pei-Liang Chiu's contributions to package substrate technology and his innovative spirit have made a lasting impact in the electronics industry. His work continues to inspire future advancements in this critical field.

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