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For the Inventor, By the Inventor

Hsinchu, Taiwan

Pei-Liang Chiu

This inventor holds 10 USPTO granted patents and 15 published patent applications and 4 EPO patents. Top assignees: Princo Corp., Princo America Corp.. Active years: 2008-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Pei-Liang Chiu. Retrieved from https://idiyas.com/inventor/pei-liang-chiu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10 

% Patents Active = 80.0

 

Average Co-Inventor Count = 1.1

ph-index = 1

Forward Citations = 8(Granted Patents)


Location History:

  • Hsinchu Science Park, TW (2008)
  • Hsinchu, TW (2011 - 2021)

Company Filing History:

goldMedal10 out of 34 
 
Princo Corp.
 patents
silverMedal1 out of 6 
 
Princo America Corp.
 patents
where one patent can have more than one assignee

Years Active: 2008-2025

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10 patents (USPTO):Explore Patents
1. 12480973 - Probe card device (2025-11-25),
2. 12412818 - Structure of package substrate (2025-09-09),
3. 12379399 - Probe card device (2025-08-05),
4. 11099524 - Wristwatch and method for improving security in electronic payment for wristwatch (2021-08-24),
5. 11048214 - Wristwatch and method applicable to wristwatch for controlling magnitude of short distance communication signals (2021-06-29),
6. 10396441 - Communication device and manufacturing method thereof (2019-08-27),
7. 10257335 - Wristwatch, mobile terminal, and communication reminding system and method (2019-04-09),
8. 10219128 - Wristwatch, wearable device, emergency help seeking method, and speed dial method (2019-02-26),
9. 7887895 - Optical disc and method for fabricating the same (2011-02-15),
10. 7316312 - Protective structure of disc packaging (2008-01-08),

Title: Pei-Liang Chiu: Innovator in Package Substrate Technology

Introduction

Pei-Liang Chiu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electronics, particularly in the development of advanced package substrate technologies. With a total of nine patents to his name, Chiu has established himself as a key figure in innovation.

Latest Patents

Chiu's latest patents include a novel structure of a package substrate. This innovative design features a first multi-layer substrate that consists of multiple dielectric layers and metal wiring layers. The structure includes a supporting substrate that is electrically connected to the multi-layer substrate without any gaps. Additionally, he has developed a probe card device that incorporates a thin film substrate, a circuit board, and a series of non-deformable probes, enhancing the efficiency of electronic testing.

Career Highlights

Throughout his career, Pei-Liang Chiu has worked with notable companies such as Princo Corporation and Princo America Corporation. His work in these organizations has allowed him to refine his skills and contribute to cutting-edge technologies in the electronics sector.

Collaborations

Chiu has collaborated with talented individuals in his field, including Phou-shen Ou and Ting-Wei Yang. These partnerships have fostered innovation and have led to the successful development of various technologies.

Conclusion

Pei-Liang Chiu's contributions to package substrate technology and his innovative spirit have made a lasting impact in the electronics industry. His work continues to inspire future advancements in this critical field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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