The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2025
Filed:
Mar. 01, 2023
Princo Corp., Hsinchu, TW;
Pei-Liang Chiu, Hsinchu, TW;
PRINCO CORP., Hsinchu, TW;
Abstract
A structure of a package substrate includes: a first multi-layer substrate including a plurality of dielectric layers and a plurality of metal wiring layers and having a first surface and a second surface which are opposite to each other; and a supporting substrate having a first surface and a second surface which are opposite to each other, wherein the first surface of the supporting substrate is disposed on the second surface of the first multi-layer substrate and electrically connected to the first multi-layer substrate, there is no gap between the first surface of the supporting substrate and the second surface of the first multi-layer substrate, the supporting substrate includes a plurality of vertical vias, and the vertical vias are used for electrically connecting the first surface of the supporting substrate to the second surface of the supporting substrate.