This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Pei-Keng Tsai: Innovator in Wafer Trimming Technologies
Introduction
Pei-Keng Tsai is an inventor based in New Taipei City, Taiwan. He has made significant contributions to the field of wafer trimming technologies. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.
Latest Patent Applications
Pei-Keng Tsai's latest patent applications include the "WAFER EDGE TRIMMING PROCESS AND METHODS THEREOF." This method involves securing a wafer on a chuck and using a water jet to create cracks along the wafer's edge. A wedge is then inserted into these cracks to remove material during the wafer's rotation. Another application is the "Multi-Blade Trimming and Dressing Tool," which features a first platen to hold a workpiece and a blade holder that rotates to trim the workpiece using multiple blades.
Conclusion
Pei-Keng Tsai's innovative approaches to wafer trimming demonstrate his potential impact on the industry. His latest patent applications highlight his commitment to advancing technology in this field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile