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For the Inventor, By the Inventor

Fremont, CA, United States of America

Pavel Kolchin

This inventor holds 10 USPTO granted patents and 2 published patent applications. Top assignee: Kla Tencor Corporation. Active years: 2016-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Pavel Kolchin. Retrieved from https://idiyas.com/inventor/pavel-kolchin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10 

% Patents Active = 90.0

Average Co-Inventor Count = 3.9

ph-index = 4

Forward Citations = 46(Granted Patents)


Company Filing History:

goldMedal10 out of 1,787 
 
Kla Tencor Corporation
 patents

Years Active: 2016-2021

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10 patents (USPTO):Explore Patents
1. 10887580 - Three-dimensional imaging for semiconductor wafer inspection (2021-01-05),
2. 10571407 - Determining information for defects on wafers (2020-02-25),
3. 10317347 - Determining information for defects on wafers (2019-06-11),
4. 10215713 - Determining a configuration for an optical element positioned in a collection aperture during wafer inspection (2019-02-26),
5. 10132760 - Apparatus and methods for finding a best aperture and mode to enhance defect detection (2018-11-20),
6. 9989479 - System and method to determine depth for optical wafer inspection (2018-06-05),
7. 9734422 - System and method for enhanced defect detection with a digital matched filter (2017-08-15),
8. 9726617 - Apparatus and methods for finding a best aperture and mode to enhance defect detection (2017-08-08),
9. 9709510 - Determining a configuration for an optical element positioned in a collection aperture during wafer inspection (2017-07-18),
10. 9389349 - System and method to determine depth for optical wafer inspection (2016-07-12),

Title: Pavel Kolchin: Innovator in Semiconductor Inspection Technologies

Introduction

Pavel Kolchin is a prominent inventor based in Fremont, California, known for his significant contributions to the field of semiconductor inspection technologies. With a total of 10 patents to his name, Kolchin has made remarkable advancements that enhance the detection and classification of defects in semiconductor wafers.

Latest Patents

Kolchin's latest patents include innovative methods and systems for three-dimensional imaging for semiconductor wafer inspection. These patents describe techniques for improved detection and classification of defects of interest on semiconductor wafers using three-dimensional images. The technology allows for accurate defect detection and estimation of defect location in three dimensions at high throughput. A series of images are acquired at various wafer depths, generating a three-dimensional image of thick semiconductor structures. Defects are identified and classified through an analysis of these images, which can be visualized using contour or cross-sectional plots. Additionally, Kolchin has developed systems for determining information for defects on wafers, utilizing illumination subsystems that direct specific wavelengths of light to induce fluorescence from certain materials on the wafer.

Career Highlights

Pavel Kolchin is currently employed at KLA-Tencor Corporation, a leading company in the semiconductor industry. His work focuses on enhancing the capabilities of semiconductor inspection systems, contributing to the overall efficiency and accuracy of defect detection processes.

Collaborations

Kolchin has collaborated with notable colleagues, including Robert M. Danen and Mikhail Haurylau, to further advance the technologies in semiconductor inspection.

Conclusion

Pavel Kolchin's innovative work in semiconductor inspection technologies has significantly impacted the industry, making him a key figure in the field. His patents reflect a commitment to improving the accuracy and efficiency of defect detection in semiconductor manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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