Yorktown Heights, NY, United States of America

Paul William Coteus

Average Co-Inventor Count = 4.3

ph-index = 31

Forward Citations = 4,119(Granted Patents)

Forward Citations (Not Self Cited) = 3,876(Sep 21, 2024)

DiyaCoin DiyaCoin 0.09 

Inventors with similar research interests:


Location History:

  • Yorktwon Heights, NY (US) (2008)
  • Yorktown Heights, NY (US) (1992 - 2021)
  • Yorktown, NY (US) (1995 - 2022)


Years Active: 1992-2022

where 'Filed Patents' based on already Granted Patents

213 patents (USPTO):
4 patents (CIPO):

Title: Paul William Coteus: A Prolific Inventor and Innovator

Introduction:

Paul William Coteus, based in Yorktown Heights, NY, is a renowned inventor and innovator in the field of technological advancements. With an impressive portfolio of 213 patents, Coteus has made significant contributions to various industries with his groundbreaking inventions. This article delves into his latest patents, career highlights, notable collaborations, and his overall impact on the field of innovation.

Latest Patents:

Coteus's recent patents showcase his expertise in developing solutions for thermal management and circuit board design. One of his notable inventions is "Mechanically Flexible Cold Plates for Low Power Components." This invention focuses on a circuit board with a versatile topology that efficiently dissipates heat from high and low power components. The use of a cold plate and thermally conductive sheet ensures optimal thermal contact and effective heat removal, enhancing the overall performance of the circuit board.

Another remarkable patent by Coteus is the "Dual-Level Pad Card Edge Self-Guide and Alignment of Connector." This invention involves a printed circuit board (PCB) with dual-level pad structures on its card edges. These structures facilitate the electrical connection between conductive layers, wiring elements, and vias. With the integration of non-conductive or conductive material, the dual-level pads offer improved electrical connectivity and alignment of connectors on the PCB.

Career Highlights:

Throughout his illustrious career, Coteus has made significant contributions to various companies. He had the privilege of working with industry giants such as IBM (International Business Machines Corporation) and GlobalFoundries Inc. At IBM, Coteus played a pivotal role in advancing chip technology, focusing on thermal management and packaging solutions. His expertise in this area led to several breakthroughs, demonstrating his dedication to tackling complex industry challenges.

Collaborations:

Coteus has collaborated with numerous talented individuals throughout his career. Notably, Gareth Geoffrey Hougham and Evan George Colgan stand out as his noteworthy coworkers. Their combined efforts have resulted in several successful projects and patents, further cementing Coteus's reputation as a collaborative and innovative inventor.

Conclusion:

Paul William Coteus's contributions to the field of innovation and patenting are truly remarkable. With 213 patents to his name, including groundbreaking inventions in thermal management and circuit board design, Coteus has demonstrated his deep understanding of technological advancements. Through his career highlights and collaborations, he has showcased his commitment to pushing the boundaries of innovation. Coteus's invaluable contributions continue to shape the landscape of inventions and patents, leaving an indelible mark on the industry for years to come.

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