Company Filing History:
Years Active: 2005-2012
Title: Paul V Miller: Innovator in Substrate Polishing Technologies
Introduction
Paul V Miller is a notable inventor based in Cupertino, CA (US). He has made significant contributions to the field of substrate polishing technologies, holding a total of 6 patents. His work focuses on improving methods and apparatus for measuring substrate edge thickness during polishing processes.
Latest Patents
One of Miller's latest patents is titled "Methods and apparatus for measuring substrate edge thickness during polishing." This invention includes a light source that transmits light to the edge of a substrate, along with detectors that detect the arrangement of light reflected from the substrate edge. A controller is also included, which determines the polishing endpoint based on the reflected light. Another significant patent is "Edge removal of silicon-on-insulator transfer wafer." This patent describes a process where a silicon-on-insulator transfer wafer is polished, involving a circumferential lip around a circular recess. The method includes masking the recess with spin-on-glass and preferentially etching away the circumferential lip.
Career Highlights
Throughout his career, Paul V Miller has worked with prominent companies such as Applied Materials, Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas in substrate polishing technologies.
Collaborations
Miller has collaborated with talented individuals in his field, including Krishna Vepa and Hong Peng Wang. Their combined expertise has contributed to the advancement of technologies related to substrate polishing.
Conclusion
Paul V Miller's contributions to substrate polishing technologies through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry positively.
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