Indialantic, FL, United States of America

Paul S Reinecke

This inventor holds 4 USPTO granted patents. Top assignee: Harris Corporation. Active years: 1985-1992.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Paul S Reinecke. Retrieved from https://idiyas.com/inventor/paul-s-reinecke

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.8

ph-index = 4

Forward Citations = 160(Granted Patents)


Company Filing History:


Years Active: 1985-1992

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4 patents (USPTO):Explore Patents

Title: Discovering Inventor Paul S. Reinecke: A Pioneer in Ultra-Thin Wafer Manufacturing

Introduction

Paul S. Reinecke, an inventive mind located in Indialantic, Florida, has made significant contributions to the field of semiconductor manufacturing. With four patents to his name, Reinecke's work focuses on the innovative production of ultra-thin dielectrically isolated wafers, vital for modern electronic devices.

Latest Patents

Reinecke's latest inventions showcase his expertise in wafer manufacturing technologies. One notable patent describes a method for manufacturing ultra-thin dielectrically isolated wafers, which includes filling etched moats with a first dielectric layer and a layer of polycrystalline material, followed by a series of planarization steps. This process leads to the creation of dielectric isolated islands essential for device forming steps.

Another significant patent involves manufacturing ultra-thin wafers using a handle wafer. This innovative method includes bonding a first device wafer to a handle wafer using an intermediate bonding oxide layer and thinning the device wafer to no greater than 7 mils. The process also allows for the addition of an epitaxial device layer and the subsequent formation of a silicon on insulator wafer.

Career Highlights

Throughout his career, Paul has been associated with Harris Corporation, where he has contributed to advancing wafer manufacturing technologies. His work has helped pave the way for improvements in the efficiency and performance of electronic components through refined manufacturing processes.

Collaborations

Reinecke has collaborated with notable colleagues such as George V. Rouse and Craig J. McLachlan. Together, they have shared insights and expertise that have furthered their innovative projects and patents in the semiconductor field.

Conclusion

In summary, Paul S. Reinecke stands out as a prominent inventor in the realm of ultra-thin wafer manufacturing. His contributions through his patents not only demonstrate his innovative capabilities but also reflect the importance of collaboration in driving groundbreaking advancements in technology. As the semiconductor industry continues to evolve, Reinecke's work remains a vital part of its foundation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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