This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 2002.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2002
Title: Paul J Pannaccione: Innovator in Chip Scale Packaging
Introduction
Paul J Pannaccione is a notable inventor based in Brookfield, CT (US). He has made significant contributions to the field of semiconductor technology, particularly in the area of chip scale packaging. His innovative approach has led to the development of a unique patent that enhances the efficiency and effectiveness of semiconductor chips.
Latest Patents
Pannaccione holds a patent for a "Chip scale package with direct attachment of chip to lead frame." This invention features outer dimensions designed for high-performance semiconductor chips, facilitating handling, testing, and subsequent attachment to electrical circuitry. The chip scale package comprises four main components: a semiconductor chip, a lead frame, a connection between the chip and the lead frame, and an encapsulation that seals the chip from the surrounding atmosphere. The semiconductor chip is designed with dimensions that are between about 70% and 80% of the outer dimensions of the package, optimizing its functionality. The lead frame includes an intermediate path that minimizes parasitic inductance and capacitance, enhancing the overall performance of the device.
Career Highlights
Pannaccione is associated with the International Business Machines Corporation (IBM), where he has contributed to various projects and innovations in semiconductor technology. His work has been instrumental in advancing the capabilities of chip scale packaging, making it a vital component in modern electronics.
Collaborations
One of his notable collaborators is James M Moniz, with whom he has worked on various projects within IBM. Their combined expertise has led to advancements in semiconductor technologies and innovations.
Conclusion
Paul J Pannaccione's contributions to chip scale packaging exemplify the spirit of innovation in the semiconductor industry. His patent and work at IBM highlight the importance of continuous development in technology, paving the way for future advancements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile