The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2002
Filed:
Feb. 23, 2000
Paul J. Pannaccione, Brookfield, CT (US);
James M. Moniz, Poughquag, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A chip scale package with outer dimensions for high of semiconductor chips to facilitate handling, testing, and later attachment of the package to further electrical circuitry. The chip scale package has four main components: semiconductor chip, a lead frame, a connection between the semiconductor chip and the lead frame, and an encapsulation sealing the semiconductor chip from the surrounding atmosphere. The semiconductor chip has a body, an active surface, and the dimensions that are between about 70% and 80% of the outer dimensions of the chip scale package. The lead frame has an intermediate path directly in line with, and perpendicular to, the surface of the semiconductor chip, thereby minimizing parasitic inductance and capacitance, and a thermal or ground slug.