This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Raytheon Company. Active years: 2023.
Company Filing History:
Years Active: 2023
Title: Paul Ingerson: Innovator in High-Density Integrated Circuit Packages
Introduction
Paul Ingerson is a notable inventor based in El Segundo, California. He has made significant contributions to the field of integrated circuit technology. His work focuses on enhancing the efficiency and functionality of multi-layer printed circuit boards.
Latest Patents
Ingerson holds a patent for "Systems and methods for break out of interconnections for high-density integrated circuit packages on a multi-layer printed circuit board." This innovative design features a multi-layer printed circuit board with strategically placed landing pads and buried vias to facilitate effective signal connections. The patent addresses the need for improved interconnections in high-density applications, showcasing Ingerson's expertise in circuit design.
Career Highlights
Paul Ingerson is currently employed at Raytheon Company, where he applies his knowledge and skills to advance technology in the defense and aerospace sectors. His work at Raytheon has allowed him to contribute to various projects that require high levels of precision and reliability.
Collaborations
Throughout his career, Ingerson has collaborated with talented professionals, including David G. Haedge and Alton Moore. These collaborations have fostered an environment of innovation and creativity, leading to advancements in their respective fields.
Conclusion
Paul Ingerson is a distinguished inventor whose work in high-density integrated circuit packages has made a lasting impact on technology. His patent and contributions at Raytheon Company highlight his commitment to innovation and excellence in engineering.