The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Oct. 18, 2021
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Thanh Tran, Dallas, TX (US);

David G. Haedge, Dallas, TX (US);

Alton Moore, McKinney, TX (US);

Paul Ingerson, El Segundo, CA (US);

Assignee:

RAYTHEON COMPANY, Waltham, MA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0228 (2013.01); H05K 1/0245 (2013.01); H05K 1/112 (2013.01); H05K 1/114 (2013.01); H05K 1/0251 (2013.01); H05K 1/181 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09636 (2013.01); H05K 2201/09672 (2013.01); H05K 2201/09718 (2013.01);
Abstract

A multi-layer printed circuit board having a first landing pad in a first layer and along a first axis arranged to receive a positive signal and a second landing pad in the first layer and along a second axis that is spaced away from the first axis longitudinally in the first layer and where the second landing pad arranged to receive a negative signal. A first buried in a second layer and along the first axis is spaced away from the first landing pad along the first axis. A second buried in the second layer and along the second axis is spaced away from the second landing pad along the second axis. A first signal connector provides a first electrical connection between the first landing pad and the second buried via and a second signal connector provides a second electrical connection between the second landing pad and the first buried via.


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