This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Raytheon Company. Active years: 2022-2023.
Company Filing History:
Years Active: 2022-2023
Title: David G. Haedge: Innovator in High-Density Integrated Circuit Technologies
Introduction
David G. Haedge is a notable inventor based in Dallas, TX (US). He has made significant contributions to the field of integrated circuit technologies, holding a total of 2 patents. His work focuses on enhancing the performance and efficiency of multi-layer printed circuit boards.
Latest Patents
David's latest patents include innovative systems and methods for breaking out interconnections for high-density integrated circuit packages on multi-layer printed circuit boards. This patent describes a multi-layer printed circuit board featuring a first landing pad designed to receive a positive signal and a second landing pad for a negative signal, ensuring effective signal management. Another significant patent is for a common mode rejection receiver, which includes a first differential amplifier that processes differential signals and a clamping circuit to limit the magnitude of the output signal. These inventions demonstrate his expertise in developing advanced electronic systems.
Career Highlights
David G. Haedge is currently employed at Raytheon Company, where he applies his innovative skills to develop cutting-edge technologies. His work at Raytheon has positioned him as a key player in the advancement of high-speed data channels and integrated circuit design.
Collaborations
David collaborates with talented professionals in his field, including his coworker Paul Ingerson. Their combined expertise contributes to the success of their projects and the advancement of technology at Raytheon.
Conclusion
David G. Haedge is a distinguished inventor whose work in high-density integrated circuit technologies has led to significant advancements in the field. His patents reflect his commitment to innovation and excellence in engineering.