Paul Henry Lego

Title: Paul Henry Lego: Innovator in Flexible Interconnect Circuits

Introduction

Paul Henry Lego is a notable inventor based in Woodside, California, with a focus on developing advanced methods for forming flexible interconnect circuits. He holds three patents that showcase his innovative contributions to the field of electronics.

Latest Patents

Lego's latest patents include methods of forming flexible interconnect circuits. One patent describes a method that involves laminating a substrate to a conductive layer and patterning the conductive layer using a laser. This process creates a first conductive portion and a second conductive portion while maintaining their orientation. Another patent outlines methods of forming interconnect circuits, which involve similar steps of laminating a substrate to a conductive layer and patterning it to form individual conductive portions. These innovative techniques allow for the use of new materials and patterning methods, enhancing the capabilities of interconnect circuits.

Career Highlights

Paul Henry Lego is currently associated with Cellink Corporation, where he applies his expertise in flexible interconnect technology. His work has significantly contributed to advancements in the field, making him a respected figure among his peers.

Collaborations

Lego collaborates with talented individuals such as Kevin Michael Coakley and Malcolm Parker Brown, who share his passion for innovation and technology.

Conclusion

Paul Henry Lego's contributions to the field of flexible interconnect circuits demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in electronic design, positioning him as a key player in the industry.