Company Filing History:
Years Active: 1985-1999
Title: Paul H Voisin: Innovator in Integrated Circuit Packaging and Photographic Materials
Introduction
Paul H Voisin is a notable inventor based in San Mateo, California. He has made significant contributions to the fields of integrated circuit packaging and photographic materials. With a total of two patents to his name, Voisin's work reflects a commitment to innovation and improvement in technology.
Latest Patents
Voisin's latest patents include a leadframe structure and process for packaging integrated circuits. This improved leadframe structure eliminates the dambar commonly found on leadframes used in plastic packages. The design incorporates a polymer structure that acts as a barrier to flashing during the epoxy encapsulation process and provides support for the leads. This innovation results in reduced capital costs and higher yields by eliminating common debar, dejunk, and deflash operations. Another significant patent is related to the method of using diazotype photographic materials with preexposure. This improved photoprinting material boasts high printing speed and is prepared by achieving a uniform distribution of sites with a refractive index different from the remainder of the coating. These sites enhance the optical path length through the film, improving the quality of the printed images.
Career Highlights
Throughout his career, Paul H Voisin has worked with several companies, including GCB Technologies, LLC and Xidex Corporation. His experience in these organizations has contributed to his expertise in the development of innovative technologies.
Collaborations
Voisin has collaborated with notable individuals in his field, including Giuseppe D Bucci and Wai-Hon Lee. These partnerships have likely fostered a creative environment that encourages the exchange of ideas and advancements in technology.
Conclusion
Paul H Voisin's contributions to integrated circuit packaging and photographic materials demonstrate his innovative spirit and dedication to improving technology. His patents reflect a deep understanding of the challenges in these fields and a commitment to finding effective solutions.