The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 1999
Filed:
Nov. 05, 1996
Giuseppe D Bucci, Monte Sereno, CA (US);
Paul H Voisin, San Mateo, CA (US);
GCB Technologies, LLC, Saratoga, CA (US);
Abstract
An improved leadframe structure and an improved IC package and process using such structure are disclosed. The improved leadframe structure eliminates the dambar commonly found on leadframes for use in plastic packages. A polymer structure is formed and employed primarily to act as a barrier to flashing during the epoxy encapsulation process and secondarily to provide support for the leads. The polymer structure remains a permanent part of the IC package following molding. An improved IC packaging process using the improved leadframe design eliminates common debar, dejunk and deflash operations, resulting in reduced capital costs and higher yields.