Paul F Bodenweber

This inventor holds 24 USPTO granted patents, primarily in Thermal Management. Top assignees: International Business Machines Corporation, Globalfoundries Inc.. Active years: 1999-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Paul F Bodenweber. Retrieved from https://idiyas.com/inventor/paul-f-bodenweber

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24

% Patents Active = 37.5

Average Co-Inventor Count = 3.7

ph-index = 6

Forward Citations = 75(Granted Patents)

Company Filing History:

23 out of 166,351

International Business Machines Corporation

Years Active: 1999-2023

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Areas of Expertise:

Thermal Management

Cooling Structure

Heat Sink

Electronic Device

Natural Draft Cooling

Semiconductor Devices

Multi-Chip Module

Thermal Interface Material

Compressive Loading

24 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11825592 - Electronic device console with natural draft cooling (2023-11-21),

2. 11035625 - Adjustable heat sink fin spacing (2021-06-15),

3. 10948247 - Adjustable heat sink fin spacing (2021-03-16),

4. 10905029 - Cooling structure for electronic boards (2021-01-26),

5. 10834808 - Electronic device console with natural draft cooling (2020-11-10),

6. 10757833 - Cooling structure for electronic boards (2020-08-25),

7. 10584924 - Adjustable heat sink fin spacing (2020-03-10),

8. 10542636 - Cooling structure for electronic boards (2020-01-21),

9. 10172258 - Cooling structure for electronic boards (2019-01-01),

10. 10088244 - Adjustable heat sink fin spacing (2018-10-02),

11. 9921008 - Adjustable heat sink fin spacing (2018-03-20),

12. 9735083 - Adjustable heat sink fin spacing (2017-08-15),

13. 9721870 - Cooling structure for electronic boards (2017-08-01),

14. 9401315 - Thermal hot spot cooling for semiconductor devices (2016-07-26),

15. 9366591 - Determining magnitude of compressive loading (2016-06-14),

Title: Paul F. Bodenweber: Innovator in Electronic Device Cooling Technologies

Introduction

Paul F. Bodenweber is a notable inventor based in Kingston, NY, recognized for his significant contributions to technology with 24 patents to his name. His work primarily focuses on enhancing the performance and efficiency of electronic devices, particularly through innovative cooling solutions.

Latest Patents

Among his latest patents, the "Electronic device console with natural draft cooling" stands out. This invention features a console body housing a chip package connected to a duct for efficient cooling. The duct acts as a chimney for natural convection cooling when the console is oriented in different ways, ensuring optimal temperature management of the chip package.

Another impressive patent is the "Adjustable heat sink fin spacing." This design incorporates a threaded rod that engages with heat sink fins, allowing for adjustable spacing based on the operating conditions of the electronic device. This innovation is crucial for maintaining optimal temperatures of heat-generating devices, enhancing their performance during operation.

Career Highlights

Paul's career has seen him collaborate with industry giants such as IBM and Globalfoundries Inc. His experience in these companies has enabled him to leverage cutting-edge research and development, further driving advancements in electronic device technology.

Collaborations

Throughout his career, Paul has worked with several talented individuals, including Kamal Kumar Sikka and Jeffrey Allen Zitz. Their collaborations have been integral in pushing the boundaries of innovation in the field of electronics, leading to the successful development of multiple patents.

Conclusion

Paul F. Bodenweber's commitment to innovation is evident in his extensive portfolio of patents. His contributions to electronic device cooling technologies have not only improved the efficiency of various devices but also set a foundation for future advancements in the industry. His work continues to have a lasting impact on the way electronic devices are designed and function, showcasing the importance of innovation in technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]