The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2016
Filed:
Mar. 26, 2015
Globalfoundries Inc., Grand Cayman, KY;
Paul F. Bodenweber, Kingston, NY (US);
Taryn J. Davis, Beacon, NY (US);
Marcus E. Interrante, New Paltz, NY (US);
Chenzhou Lian, Poughquag, NY (US);
Kenneth C. Marston, Poughquag, NY (US);
Kathryn C. Rivera, Hopewell Junction, NY (US);
Kamal K. Sikka, Poughkeepsie, NY (US);
Hilton T. Toy, Hopewell Junction, NY (US);
GLOBALFOUNDRIES Inc., Grand Cayman, KY;
Abstract
A semiconductor device package which includes a semiconductor package, a semiconductor device joined to the semiconductor package; and a lid to be placed over the semiconductor device and joined to the semiconductor package. The lid includes: a block of a first material having a first surface and a second surface, the second surface facing the semiconductor device, the block having perforations extending between the first surface and the second surface; inserts for filling the perforations, each of the inserts being made of a second material, at least one of the inserts protrudes beyond the second surface towards the semiconductor device; and a bonding material to bond the inserts to the block so that the at least one of the inserts protrudes beyond the second surface towards the semiconductor device. Also included is a method of assembling a semiconductor device package.