Corvallis, OR, United States of America

Paul David Schweitzer

USPTO Granted Patents = 6 

 

Average Co-Inventor Count = 4.4

ph-index = 2

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 2007-2023

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6 patents (USPTO):Explore Patents

Title: Paul David Schweitzer: Innovator in Molded Substrates

Introduction

Paul David Schweitzer is a notable inventor based in Corvallis, OR (US). He has made significant contributions to the field of molded substrates, holding a total of 6 patents. His work primarily focuses on the integration of circuitry within molded substrates, which has implications for various technological applications.

Latest Patents

Among his latest patents, Schweitzer has developed innovative solutions such as molded substrates that support integrated circuitry. These substrates can be relatively flat and may include molding remnants. Another significant patent involves cassette substrates made of modified polyetherimide (PEI). This technology is crucial for systems that require precise fluid ejection into assays, showcasing the versatility and importance of his inventions.

Career Highlights

Schweitzer is currently associated with Hewlett-Packard Development Company, L.P., where he continues to push the boundaries of technology through his inventive work. His career is marked by a commitment to advancing the capabilities of molded substrates in various applications.

Collaborations

Throughout his career, Schweitzer has collaborated with talented individuals such as Dale Timm and Hai Quang Tran. These partnerships have contributed to the development of innovative technologies and have enhanced the impact of his work in the industry.

Conclusion

Paul David Schweitzer is a distinguished inventor whose work in molded substrates has paved the way for advancements in integrated circuitry applications. His contributions continue to influence the field and demonstrate the importance of innovation in technology.

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