The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2023
Filed:
Oct. 04, 2019
Applicant:
Hewlett-packard Development Company, L.p., Fort Collins, CO (US);
Inventors:
Michael Wayne Cumbie, Albany, OR (US);
Paul David Schweitzer, Corvallis, OR (US);
Anthony Donald Studer, Albany, OR (US);
Gary Gerard Lutnesky, Corvallis, OR (US);
John Edward Davis, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/673 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67356 (2013.01); B41J 2/1637 (2013.01);
Abstract
Examples of molded substrates are described herein. In some examples, a molded substrate may support integrated circuitry. In some examples, the molded substrate and the integrated circuitry are included in a circuitry package for a replaceable print component. In some examples, the molded substrate is relatively flat. In some examples, molding remnants may be on the molded substrate.