Paul A Ogden

Title: Paul A. Ogden: Innovator in Integrated Circuit Technology

Introduction

Paul A. Ogden is a notable inventor based in Phoenix, AZ, recognized for his contributions to integrated circuit technology. With a total of 2 patents, Ogden has made significant advancements in the field, particularly in the design and inspection of semiconductor components.

Latest Patents

Ogden's latest patents include an innovative integrated circuit package with a removable shield. This design features an integrated circuit mounted on a TAB carrier, with a removable shield made from spring material that allows limited access to the integrated circuit. His second patent focuses on a bond inspection technique for semiconductor chips. This technique utilizes a camera to form an infra-red intensity image of the semiconductor chip, allowing for the assessment of bond integrity by comparing the infra-red data of known good and bad bonds.

Career Highlights

Throughout his career, Paul A. Ogden has been associated with Motorola Corporation, where he has played a pivotal role in developing cutting-edge technologies. His work has contributed to enhancing the reliability and performance of semiconductor devices.

Collaborations

Ogden has collaborated with esteemed colleagues such as Shay-Ping T. Wang and Walter L. Moulton, further enriching his contributions to the field of integrated circuits.

Conclusion

Paul A. Ogden's innovative work in integrated circuit technology has left a lasting impact on the industry. His patents reflect a commitment to advancing semiconductor technology and improving inspection techniques.