Motorola Corporation

Paul A Ogden

Shay-Ping T Wang

Christopher J LeBeau

Walter L Moulton

An integrated circuit package with a removable shield is disclosed. An integrated circuit having a plurality of interface leads is mounted on a TAB carrier. A removable shield fabricated from a spring material is clipped to the TAB carrier. A limited opening through the removable shield allows a predetermined access to the integrated circuit.

Integrated circuit package with removable shield

A bond inspection technique which determines the integrity of a plurality of package leads (13) bonded to a plurality of contact areas (12) on a semiconductor chip (11). A bonding process heats each package lead (13) bonded to each contact area (12). A camera (16) forms an infra-red intensity image at a predetermined time of the semiconductor chip (11) and ports image data to a computer (18). Infra-red intensity radiated from each bond on the semiconductor chip (11) is compared by the computer (18) with infra-red intensity data of known good and bad bonds. The comparison of each bond determines bond integrity of the semiconductor chip (11).

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Phoenix, AZ, United States of America

Paul A Ogden