This inventor holds 2 USPTO granted patents. Top assignee: Nxp B.v.. Active years: 2016-2017.
Company Filing History:
Years Active: 2016-2017
Title: Patrick Schoengrundner: Innovator in Dual-Interface IC Card Technology
Introduction
Patrick Schoengrundner is a notable inventor based in Graz, Austria. He has made significant contributions to the field of integrated circuit technology, particularly in the development of dual-interface IC card components. With a total of 2 patents to his name, Schoengrundner's work has advanced the functionality and manufacturing processes of IC cards.
Latest Patents
Schoengrundner's latest patents focus on dual-interface integrated circuit (IC) card components and methods for their manufacturing. One embodiment describes a dual-interface IC card component that features a single-sided contact base structure. This structure includes a substrate with an electrical contact layer. Additionally, one or more antenna contact leads are attached to the single-sided contact base structure. This forms a dual-interface contact structure by applying an adhesive material to partially cover an overlapping area of the antenna contact and the substrate. This innovation is crucial for enhancing the performance of dual-interface IC cards.
Career Highlights
Patrick Schoengrundner is currently employed at NXP B.V., a leading company in the semiconductor industry. His work at NXP has allowed him to focus on cutting-edge technologies that improve the efficiency and capabilities of IC cards. His contributions have been instrumental in the evolution of secure and versatile payment solutions.
Collaborations
Schoengrundner has collaborated with notable colleagues such as Christian Zenz and Johannes Wilhelmus Van Rijckevorsel. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Patrick Schoengrundner's work in dual-interface IC card technology exemplifies the impact of innovation in the semiconductor industry. His patents and collaborations continue to shape the future of integrated circuit applications.