Nxp B.v.

Patrick Schoengrundner

Christian Zenz

Tonny Kamphuis

Ernst Eiper

Bodin Kasemset

Boudewijn Van Blokland

Johannes Wilhelmus Van Rijckevorsel

David Ceccarelli

Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate, which is a component of a dual-interface IC card. Other embodiments are also described.

Dual-interface IC card components and method for manufacturing the dual-interface IC card components

Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure, which is a component of a dual-interface IC card. Other embodiments are also described.

Dual interface IC card components and method for manufacturing the dual-interface IC card components

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Graz, Austria

Patrick Schoengrundner