Patrick Michael O'Leary

Title: **Inventor Profile: Patrick Michael O'Leary**

Introduction

Patrick Michael O'Leary is an accomplished inventor based in Redding, Connecticut, who has made significant contributions to technology through his innovative patent. With a focus on enhancing chip carrier capabilities, his work exemplifies the spirit of creativity and problem-solving within the tech industry.

Latest Patents

Patrick Michael O'Leary holds one patent titled "Ball grid array by partitioned lamination process." This patent describes a method for forming a ball grid array to provide a chip carrier with improved input/output capabilities. The process involves a combination of three distinct steps: partitioning a solder sheet into identical pieces using a mask matching the chip carrier's footprint, reflowing these solder pieces into solder balls, and ultimately joining the balls to the I/O pads of the chip carrier. By integrating these steps, the method facilitates a high throughput, high volume, and a defect-free and contamination-free operation for forming I/O connections.

Career Highlights

O'Leary is associated with the International Business Machines Corporation, commonly known as IBM. His role within the company highlights his commitment to advancing technology and reinforcing IBM's position as a leader in the field of innovation.

Collaborations

Throughout his career, Patrick has collaborated with skilled professionals, including Roy Rongqing Yu and William Harrington Brearley. These collaborations emphasize the importance of teamwork in driving innovation and achieving successful outcomes in the tech industry.

Conclusion

Patrick Michael O'Leary is a noteworthy inventor whose work in chip carrier technology reflects a profound understanding of engineering processes. His patent not only showcases his inventive spirit but also contributes to the broader landscape of technological advancements within IBM and the industry as a whole.