The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 1998

Filed:

Jun. 17, 1996
Applicant:
Inventors:

Roy Yu, Wappingers Falls, NY (US);

William Harrington Brearley, Poughkeepsie, NY (US);

Kimberley Ann Kelly, Poughkeepsie, NY (US);

Patrick Michael O'Leary, Redding, CT (US);

Arthur Gilman Merryman, Hopewell Junction, NY (US);

James Patrick Wood, Beacon, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228254 ; 22818022 ; 228 14 ;
Abstract

A method for forming a ball grid array to provide a chip carrier with I/O capabilities is described. The method includes combining three distinct steps into one: partitioning a solder sheet into identical solder pieces using a mask provided with openings that match the footprint of the chip carrier; reflowing the solder pieces into solder balls; and joining the balls to the I/O pads of the chip carrier. By combining these three steps into one, a high throughput, high volume, defect free and contamination free operation for forming I/O connections thus results.


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